Direct bonding and de?bonding on demand of polystyrene and polyamide surfaces, treated with oxygen plasma

Smooth polystyrene (PS) and polyamide 12 (PA 12) surfaces were produced via an injection molding process followed by a smoothing subsequently treated with O2 plasma to increase the number of polar groups capable hydrogen bond formation on surface. The presence related was evident from X-ray photoelectron spectroscopy (XPS) contact angle measurements. sample topographies investigated atomic force microscopy (AFM). treatment allowed joining substrates without adhesive pressing together below or around glass transition temperature. Notably, not only same polymer but also PS PA 12, which are incompatible, joined this method. adhesion between determined using LUMifrac apparatus. strength increased increasing bonding temperature when both plasma-treated, reaching strengths up 5.5 ± 1.7 MPa. Remarkably, joint could be rapidly de-bonded demand simply water, separated re-bonded renewed treatment.